APPLICATIONS:
- Semiconductor Wafer Cleaning (Wet Bench) Processes
- Heating of Photo-Resist Removal Solvents
- DI water Heating for Wafer Rinsing
- Air and Nitrogen Heating for Wafer Drying
- Heating of Acids, IPA, Piranha, NMP, etc.
- For Use with Single Pass or Recirculating Systems
FEATURES & BENEFITS:
- Fluid Path has No Contact with Heating Elements
- Media is Isolated in PFA (Teflon®) Flow-Tube (High Purity Heating)
- Allows for Safe Heating of Dangerous Liquids & Gases
- Flow-Tube is Safe for Use with Many Caustic Solvents
- Flow-Tube Is Field Replaceable (No Service Call Required)
- Compatible with Standard Controls (PID, PLC, Multi-Loop, etc.)
- Body is Teflon® Coated, for Maximum Cleanliness
- Self-Draining Flow-Tubes, and Long-Life Heating Elements
Specifications:
Power:
- 5 kW Total to 7.9 kW Total
- Voltage Range: 200 – 480 V
- Max Line Current: 30 A per circuit
Tubing:
- .375” OD (3/8”) (9.52 mm)
- .031” Wall (.80 mm)
- Overall Process Tube Length: 325″ (8255 mm)
- PFA (PerFluoroAlkoxy) / Teflon® (standard)
- High Purity PFA (optional upgrade)
- Max Pressure: 70 psi (4.82 bar)
Body:
- Aluminum with Black Teflon® Protective Coating
Enclosures:
- NEMA 7 (explosion-proof)
Max Working Temperature:
- 392°F (200°C)
Sensors:
- K or J Type Thermocouples Standard (Qty. 3)
- 1 for Process Control
- 1 for High-Limit Protection
- 1 for Tube Temperature Protection
Available Accessories:
- Insulating Jackets
- Compression Fittings
| PUR-X 2000 |
